Wafer Bonding of Plasma Activated Surfaces

Thomas Plach; V. Dragoi; Gerald Mittendorfer; Markus Wimplinger; Kurt Hingerl

doi:10.1149/1.3007997

Wafer Bonding of Plasma Activated Surfaces

Thomas Plach
, V. Dragoi
, Gerald Mittendorfer
, Markus Wimplinger
, Kurt Hingerl

Center for Surface and Nanoanalytics

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	39-45
Number of pages	7
Journal	ECS Transactions - Electrochemical Society
Volume	13
Issue number	25
DOIs	https://doi.org/10.1149/1.3007997
Publication status	Published - 2008

Fields of science

210006 Nanotechnology
103020 Surface physics
103021 Optics

JKU Focus areas

Engineering and Natural Sciences (in general)

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10.1149/1.3007997

Cite this

@article{413585f00fa8415093a8198b8f275fc7,

title = "Wafer Bonding of Plasma Activated Surfaces",

author = "Thomas Plach and V. Dragoi and Gerald Mittendorfer and Markus Wimplinger and Kurt Hingerl",

year = "2008",

doi = "10.1149/1.3007997",

language = "English",

volume = "13",

pages = "39--45",

journal = "ECS Transactions - Electrochemical Society",

issn = "1938-5862",

number = "25",

}

TY - JOUR

T1 - Wafer Bonding of Plasma Activated Surfaces

AU - Plach, Thomas

AU - Dragoi, V.

AU - Mittendorfer, Gerald

AU - Wimplinger, Markus

AU - Hingerl, Kurt

PY - 2008

Y1 - 2008

UR - https://www.scopus.com/pages/publications/67650388503

U2 - 10.1149/1.3007997

DO - 10.1149/1.3007997

M3 - Article

SN - 1938-5862

VL - 13

SP - 39

EP - 45

JO - ECS Transactions - Electrochemical Society

JF - ECS Transactions - Electrochemical Society

IS - 25

ER -

Wafer Bonding of Plasma Activated Surfaces

Fields of science

JKU Focus areas

Access to Document

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