Wafer Bonding

Bernhard Rebhan, Viorel Dragoi, Thomas Plach, Christoph Flötgen, Kurt Hingerl, Markus Wimplinger, Razek Nasser

Research output: Contribution to journal › Article › peer-review

Original language	English
Number of pages	1
Journal	Surface and Interface Analysis
Volume	9
DOIs	https://doi.org/10.1002/9783527822492.ch62
Publication status	Published - Jan 2020

Fields of science

@article{4e7f0b0b1b0a47fd8003eafb03fbf58f,

title = "Wafer Bonding",

author = "Bernhard Rebhan and Viorel Dragoi and Thomas Plach and Christoph Fl{\"o}tgen and Kurt Hingerl and Markus Wimplinger and Razek Nasser",

year = "2020",

month = jan,

doi = "10.1002/9783527822492.ch62",

language = "English",

volume = "9",

journal = "Surface and Interface Analysis",

issn = "1096-9918",

publisher = "Wiley",

}

TY - JOUR

T1 - Wafer Bonding

AU - Rebhan, Bernhard

AU - Dragoi, Viorel

AU - Plach, Thomas

AU - Flötgen, Christoph

AU - Hingerl, Kurt

AU - Wimplinger, Markus

AU - Nasser, Razek

PY - 2020/1

Y1 - 2020/1

U2 - 10.1002/9783527822492.ch62

DO - 10.1002/9783527822492.ch62

M3 - Article

SN - 1096-9918

VL - 9

JO - Surface and Interface Analysis

JF - Surface and Interface Analysis

ER -