TY - GEN
T1 - Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips
AU - Fuchsluger, Andreas
AU - De Pastina, Annalisa
AU - Cselyuszka, Norbert
AU - Andrianov, Nikolai
AU - Roshanghias, Ali
AU - Mitteramskogler, Tina
AU - Ecker, Rafael
AU - Voglhuber-Brunnmaier, Thomas
AU - Moridi, Mohssen
AU - Jakoby, Bernhard
PY - 2022/12
Y1 - 2022/12
N2 - By establishing and exploring a numeric model of an
acoustofluidic device driven by a piezoelectric plate
transducer, we discovered simple and distinct vibrational
patterns with high displacement amplitudes for a lateral
vibrational mode of the transducer plate. With the design
based on a numerically optimized chip-geometry for this
particular lateral mode, we fabricated high-performant chips
enabling rapid and accurate particle focusing, where the
acoustic energy density is exceeding 100 J/m3 at actuation
frequencies around 540 kHz, while heat generation remains
low. We excite higher order harmonics leading to multiple
separate lines of particles along the channel. With the custommade
chip holder featuring integrated fluid connections and
transducer support, we are moreover able to swiftly mount
microfluidic chips directly after dicing without any further
preparation.
AB - By establishing and exploring a numeric model of an
acoustofluidic device driven by a piezoelectric plate
transducer, we discovered simple and distinct vibrational
patterns with high displacement amplitudes for a lateral
vibrational mode of the transducer plate. With the design
based on a numerically optimized chip-geometry for this
particular lateral mode, we fabricated high-performant chips
enabling rapid and accurate particle focusing, where the
acoustic energy density is exceeding 100 J/m3 at actuation
frequencies around 540 kHz, while heat generation remains
low. We excite higher order harmonics leading to multiple
separate lines of particles along the channel. With the custommade
chip holder featuring integrated fluid connections and
transducer support, we are moreover able to swiftly mount
microfluidic chips directly after dicing without any further
preparation.
UR - https://ieeexplore.ieee.org/document/9967272
UR - http://www.scopus.com/inward/record.url?scp=85144083805&partnerID=8YFLogxK
U2 - 10.1109/SENSORS52175.2022.9967272
DO - 10.1109/SENSORS52175.2022.9967272
M3 - Conference proceedings
T3 - Proceedings of IEEE Sensors
BT - 2022 IEEE Sensors
ER -