Abstract
A fabrication process for polymeric microfluidic
devices using a solvent bonding technique is
presented. Liquid gallium is filled into the channels
beforehand, in order to keep their structural integrity
intact during the bonding process. Due to its melting
point just above room temperature, gallium features
several advantages compared to other materials used
in a similar fashion. The proposed method does not
require special equipment and is especially suitable
for rapid prototyping on a small academic lab scale.
| Original language | English |
|---|---|
| Title of host publication | Conference Proceedings of the 4th Conference on MicroFluidic Handling Systems |
| Pages | 152-155 |
| Number of pages | 4 |
| Publication status | Published - Oct 2019 |
Fields of science
- 202019 High frequency engineering
- 202021 Industrial electronics
- 202036 Sensor systems
- 203017 Micromechanics
- 202 Electrical Engineering, Electronics, Information Engineering
- 202027 Mechatronics
- 202028 Microelectronics
- 202037 Signal processing
JKU Focus areas
- Digital Transformation