Transient Measurement Method for the Thermal Properties of the Thin-Film Membrane in a Multi-Parameter Wind Sensor

Roman Beigelbeck, Samir Cerimovic, Franz Kohl, Thomas Voglhuber-Brunnmaier, Bernhard Jakoby, D. Reyes-Romero, G.A. Urban

Research output: Chapter in Book/Report/Conference proceedingConference proceedingspeer-review

Abstract

The performance of our previously devised thermal multi-parameter wind sensor for gaseous fluids is noticeably influenced by the thermal heat shunt induced by the thin-film membrane where heating and temperature sensing elements are embedded. Consequently, reliable values for the thermal parameters of the thin-film membrane are mandatory for their design and characterization. We present a new method to determine the thermal conductivity, thermal diffusivity, and average spectral emissivity of the thin-film membrane. Compared to commonly used measurement techniques for these thermal thin-film parameters, our method does not require custom-built specimens, i. e., the results can be obtained from transient excess temperature measurements carried out directly on the wind sensor device. We describe the theoretical background of this method, provide an efficient analytical model for the data evaluation including its validation by computer numerical analyses, and showcase sample measurements on multi-layer SixNy-SiO2 thin films.
Original languageEnglish
Title of host publicationProceedings IEEE Sensors
EditorsFrancisco J. Arregui
Pages1304-1307
Number of pages4
ISBN (Electronic)9781479901616
DOIs
Publication statusPublished - 12 Dec 2014

Publication series

NameProceedings of IEEE Sensors
NumberDecember
Volume2014-December
ISSN (Print)1930-0395
ISSN (Electronic)2168-9229

Fields of science

  • 202019 High frequency engineering
  • 202021 Industrial electronics
  • 202036 Sensor systems
  • 203017 Micromechanics
  • 202 Electrical Engineering, Electronics, Information Engineering
  • 202027 Mechatronics
  • 202028 Microelectronics
  • 202037 Signal processing

JKU Focus areas

  • Mechatronics and Information Processing

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