Thermal Condition Monitoring System Fully Printed on a 3D Substrate

Marcel Knoll; Christina Offenzeller; Bernhard Mayrhofer; Bernhard Jakoby; Wolfgang Hilber

Thermal Condition Monitoring System Fully Printed on a 3D Substrate

Marcel Knoll, Christina Offenzeller, Bernhard Mayrhofer, Bernhard Jakoby, Wolfgang Hilber

Institute of Microelectronics and Microsensors

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

Abstract

In this work we present a condition monitoring device which is fabricated in a low cost printing process directly on the 3D shaped substrate. The temperature monitoring is performed by 24 thermocouples resulting in a 24 pixel temperature image of the sample. The thermocouples are printed in an array arrangement, which enables the reduction of the required connections from 48 to 25. The printing is performed in a two-step process in which first the sensor pattern is screen printed onto a transfer foil and then transferred in a second step onto the target substrate by water transfer printing.

Original language	English
Title of host publication	Proceedings IEEE Sensors 2019
Number of pages	4
Publication status	Published - Oct 2019

Fields of science

202019 High frequency engineering
202021 Industrial electronics
202036 Sensor systems
203017 Micromechanics
202 Electrical Engineering, Electronics, Information Engineering
202027 Mechatronics
202028 Microelectronics
202037 Signal processing

JKU Focus areas

Digital Transformation

Cite this

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title = "Thermal Condition Monitoring System Fully Printed on a 3D Substrate",

abstract = "In this work we present a condition monitoring device which is fabricated in a low cost printing process directly on the 3D shaped substrate. The temperature monitoring is performed by 24 thermocouples resulting in a 24 pixel temperature image of the sample. The thermocouples are printed in an array arrangement, which enables the reduction of the required connections from 48 to 25. The printing is performed in a two-step process in which first the sensor pattern is screen printed onto a transfer foil and then transferred in a second step onto the target substrate by water transfer printing.",

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PY - 2019/10

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AB - In this work we present a condition monitoring device which is fabricated in a low cost printing process directly on the 3D shaped substrate. The temperature monitoring is performed by 24 thermocouples resulting in a 24 pixel temperature image of the sample. The thermocouples are printed in an array arrangement, which enables the reduction of the required connections from 48 to 25. The printing is performed in a two-step process in which first the sensor pattern is screen printed onto a transfer foil and then transferred in a second step onto the target substrate by water transfer printing.

M3 - Conference proceedings

BT - Proceedings IEEE Sensors 2019

ER -