Original language | English |
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Title of host publication | Thermal Stresses '99, Proc. of the Third Internat. Congress on Thermal Stresses, Cracow, Poland 1999 |
Editors | J.J. Skrzypek, R.B. Hetnarski |
Pages | 157-160 |
Number of pages | 4 |
Publication status | Published - Jun 1999 |
Fields of science
- 102009 Computer simulation
- 203015 Mechatronics
- 203022 Technical mechanics