Stress evolution during and after sputter deposition of thin Cu-Al alloy films

M. Pletea, H. Wendrock, R. Kaltofen, Oliver G. Schmidt, Reinhold Koch

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Article number255215
Pages (from-to)255215/1-6
Number of pages6
JournalJournal of Physics: Condensed Matter
Volume20
Issue number25
DOIs
Publication statusPublished - 25 Jun 2008

Fields of science

  • 103 Physics, Astronomy
  • 103009 Solid state physics
  • 103011 Semiconductor physics
  • 103017 Magnetism
  • 103018 Materials physics
  • 210006 Nanotechnology
  • 103040 Photonics
  • 202032 Photovoltaics

Cite this