Quality Assurance for Wire Connections used in Integrated Circuits via Magnetic Imaging

Patrick Hölzl, Thomas Wiesner, Bernhard Zagar

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

Original language	English
Title of host publication	2012 IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2012) Proceedings
Pages	2051-2056
Number of pages	6
Publication status	Published - May 2012

Fields of science

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title = "Quality Assurance for Wire Connections used in Integrated Circuits via Magnetic Imaging",

author = "Patrick H{\"o}lzl and Thomas Wiesner and Bernhard Zagar",

year = "2012",

month = may,

language = "English",

isbn = "978-1-4577-1771-0",

pages = "2051--2056",

booktitle = "2012 IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2012) Proceedings",

}

Quality Assurance for Wire Connections used in Integrated Circuits via Magnetic Imaging. / Hölzl, Patrick; Wiesner, Thomas; Zagar, Bernhard.
2012 IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2012) Proceedings. 2012. p. 2051-2056 6229127.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

TY - GEN

T1 - Quality Assurance for Wire Connections used in Integrated Circuits via Magnetic Imaging

AU - Hölzl, Patrick

AU - Wiesner, Thomas

AU - Zagar, Bernhard

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UR - http://imtc.ieee-ims.org/

M3 - Conference proceedings

SN - 978-1-4577-1771-0

SP - 2051

EP - 2056

BT - 2012 IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2012) Proceedings

ER -