TY - GEN
T1 - Properties of Thermal Devices and Sensors on Porous Silicon Substrates
AU - Lucklum, Frieder
AU - Schwaiger, Alexander
AU - Jakoby, Bernhard
PY - 2012/10
Y1 - 2012/10
N2 - Miniaturized thermal devices, such as microheaters, temperature sensors, flow sensors, gas and humidity sensors, usually require thin substrates of low thermal conductivity to minimize thermal losses and improve sensitivity and efficiency. Porous silicon offers an alternative to standard substrates such as thin glass or silicon nitride membranes. In this work we present fabrication details of this technology as well as static and dynamic device and material characterization. The reduction of thermal conductivity is estimated with the dynamic 3 technique and compared to pure silicon wafers.
AB - Miniaturized thermal devices, such as microheaters, temperature sensors, flow sensors, gas and humidity sensors, usually require thin substrates of low thermal conductivity to minimize thermal losses and improve sensitivity and efficiency. Porous silicon offers an alternative to standard substrates such as thin glass or silicon nitride membranes. In this work we present fabrication details of this technology as well as static and dynamic device and material characterization. The reduction of thermal conductivity is estimated with the dynamic 3 technique and compared to pure silicon wafers.
UR - http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6411261
UR - http://www.scopus.com/inward/record.url?scp=84873940920&partnerID=8YFLogxK
U2 - 10.1109/ICSENS.2012.6411261
DO - 10.1109/ICSENS.2012.6411261
M3 - Conference proceedings
SN - 9781457717659
T3 - Proceedings of IEEE Sensors
SP - 1132
EP - 1135
BT - 2012 IEEE SENSORS Proceedings
PB - IEEE
CY - Piscataway, NJ, USA
ER -