Processing of Interference Fringe Patterns to obtain highly localized Strain

Bernd Arminger; Bernhard Zagar

Processing of Interference Fringe Patterns to obtain highly localized Strain

Bernd Arminger
, Bernhard Zagar

Institute of Measurement Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

Abstract

Mechanical strain and displacement measurements are important in general material testing. Especially non-contacting methods like optical measurement are needed to analyze the behaviour of micro materials since no other standard method is otherwise available. In this paper a measurement method is introduced that fulfills these requirements. The device under test has to be prepared only with two Vickers micro hardness indentations. These two markers are illuminated by a collimated laser beam. The mechanical strain or displacement can be measured by scanning the diffracted light field using two CCD line scan cameras. The measurement system is able to resolve displacement of these indentations in the nm range.

Original language	English
Title of host publication	International Workshop on Imaging Systems and Techniques
Number of pages	3
Publication status	Published - 2006

Fields of science

101014 Numerical mathematics
102003 Image processing
103021 Optics
202 Electrical Engineering, Electronics, Information Engineering
202012 Electrical measurement technology
202014 Electromagnetism
202015 Electronics
202016 Electrical engineering
202021 Industrial electronics
202022 Information technology
202024 Laser technology
202027 Mechatronics
202036 Sensor systems
202037 Signal processing
202039 Theoretical electrical engineering
203016 Measurement engineering
211908 Energy research

Cite this

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title = "Processing of Interference Fringe Patterns to obtain highly localized Strain",

abstract = "Mechanical strain and displacement measurements are important in general material testing. Especially non-contacting methods like optical measurement are needed to analyze the behaviour of micro materials since no other standard method is otherwise available. In this paper a measurement method is introduced that fulfills these requirements. The device under test has to be prepared only with two Vickers micro hardness indentations. These two markers are illuminated by a collimated laser beam. The mechanical strain or displacement can be measured by scanning the diffracted light field using two CCD line scan cameras. The measurement system is able to resolve displacement of these indentations in the nm range.",

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year = "2006",

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booktitle = "International Workshop on Imaging Systems and Techniques",

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AU - Zagar, Bernhard

PY - 2006

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N2 - Mechanical strain and displacement measurements are important in general material testing. Especially non-contacting methods like optical measurement are needed to analyze the behaviour of micro materials since no other standard method is otherwise available. In this paper a measurement method is introduced that fulfills these requirements. The device under test has to be prepared only with two Vickers micro hardness indentations. These two markers are illuminated by a collimated laser beam. The mechanical strain or displacement can be measured by scanning the diffracted light field using two CCD line scan cameras. The measurement system is able to resolve displacement of these indentations in the nm range.

AB - Mechanical strain and displacement measurements are important in general material testing. Especially non-contacting methods like optical measurement are needed to analyze the behaviour of micro materials since no other standard method is otherwise available. In this paper a measurement method is introduced that fulfills these requirements. The device under test has to be prepared only with two Vickers micro hardness indentations. These two markers are illuminated by a collimated laser beam. The mechanical strain or displacement can be measured by scanning the diffracted light field using two CCD line scan cameras. The measurement system is able to resolve displacement of these indentations in the nm range.

M3 - Conference proceedings

BT - International Workshop on Imaging Systems and Techniques

ER -