Plasma Activation for Low Temperature Wafer Bonding

Thomas Plach, V. Dragoi, Franz Murauer, Kurt Hingerl

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	549-559
Number of pages	11
Journal	ECS Transactions - Electrochemical Society
Volume	16
DOIs	https://doi.org/10.1149/ma2008-02/33/2195
Publication status	Published - 2008

Fields of science

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title = "Plasma Activation for Low Temperature Wafer Bonding",

author = "Thomas Plach and V. Dragoi and Franz Murauer and Kurt Hingerl",

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language = "English",

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T1 - Plasma Activation for Low Temperature Wafer Bonding

AU - Plach, Thomas

AU - Dragoi, V.

AU - Murauer, Franz

AU - Hingerl, Kurt

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U2 - 10.1149/ma2008-02/33/2195

DO - 10.1149/ma2008-02/33/2195

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VL - 16

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EP - 559

JO - ECS Transactions - Electrochemical Society

JF - ECS Transactions - Electrochemical Society

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