Abstract
In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers.
| Original language | English |
|---|---|
| Patent number | US11694977B2 |
| Publication status | Published - 04 Jul 2023 |
Fields of science
- 103008 Experimental physics
- 103 Physics, Astronomy
- 103020 Surface physics
- 103021 Optics
- 210006 Nanotechnology
- 103015 Condensed matter
- 103013 Ion physics
- 210004 Nanomaterials
- 104018 Polymer chemistry
- 103023 Polymer physics
- 210001 Nanoanalytics
- 103009 Solid state physics
- 202012 Electrical measurement technology
- 104014 Surface chemistry
- 103018 Materials physics
- 503015 Subject didactics of technical sciences
- 103017 Magnetism
- 103005 Atomic physics
- 202036 Sensor systems
- 203016 Measurement engineering
JKU Focus areas
- Sustainable Development: Responsible Technologies and Management