Mechanisms for room temperature direct wafer bonding

Thomas Plach; Kurt Hingerl; Sajjad Tollabimazraehno; Günter Hesser; V. Dragoi; Markus Wimplinger

doi:10.1063/1.4794319

Mechanisms for room temperature direct wafer bonding

Thomas Plach, Kurt Hingerl, Sajjad Tollabimazraehno, Günter Hesser, V. Dragoi, Markus Wimplinger

Center for Surface and Nanoanalytics

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	094905
Pages (from-to)	094905
Number of pages	1
Journal	Journal of Applied Physics
Volume	113
Issue number	9
DOIs	https://doi.org/10.1063/1.4794319
Publication status	Published - 2013

Fields of science

103 Physics, Astronomy
103020 Surface physics
103021 Optics
210006 Nanotechnology

JKU Focus areas

Engineering and Natural Sciences (in general)

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10.1063/1.4794319

Cite this

@article{0195edd85fff42268071874c1f61dd28,

title = "Mechanisms for room temperature direct wafer bonding",

author = "Thomas Plach and Kurt Hingerl and Sajjad Tollabimazraehno and G{\"u}nter Hesser and V. Dragoi and Markus Wimplinger",

year = "2013",

doi = "10.1063/1.4794319",

language = "English",

volume = "113",

pages = "094905",

journal = "Journal of Applied Physics",

issn = "1089-7550",

publisher = "American Institute of Physics",

number = "9",

}

TY - JOUR

T1 - Mechanisms for room temperature direct wafer bonding

AU - Plach, Thomas

AU - Hingerl, Kurt

AU - Tollabimazraehno, Sajjad

AU - Hesser, Günter

AU - Dragoi, V.

AU - Wimplinger, Markus

PY - 2013

Y1 - 2013

UR - https://www.scopus.com/pages/publications/84874759650

U2 - 10.1063/1.4794319

DO - 10.1063/1.4794319

M3 - Article

SN - 1089-7550

VL - 113

SP - 094905

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 9

M1 - 094905

ER -

Mechanisms for room temperature direct wafer bonding

Fields of science

JKU Focus areas

Access to Document

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