Laser-induced particle removal from silicon wafers

Paul Leiderer; J. Boneberg; V. Dobler; M. Mosbacher; H.-J. Münzer; T. Fourrier; Gernot Schrems; Dieter Bäuerle; Jakub Siegel; N. Chaoui; J. Solis; C. N. Afonso

doi:10.1117/12.407353

Laser-induced particle removal from silicon wafers

Paul Leiderer, J. Boneberg, V. Dobler, M. Mosbacher, H.-J. Münzer, T. Fourrier, Gernot Schrems, Dieter Bäuerle, Jakub Siegel, N. Chaoui, J. Solis, C. N. Afonso

Institute of Applied Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

Original language	English
Title of host publication	High Power Laser Ablation III
Pages	249-259
Number of pages	11
Volume	4065
DOIs	https://doi.org/10.1117/12.407353
Publication status	Published - 2000

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)	0277-786X

Fields of science

103016 Laser physics
210005 Nanophotonics

JKU Focus areas

Engineering and Natural Sciences (in general)

Access to Document

10.1117/12.407353

Cite this

Leiderer, P., Boneberg, J., Dobler, V., Mosbacher, M., Münzer, H.-J., Fourrier, T., Schrems, G., Bäuerle, D., Siegel, J., Chaoui, N., Solis, J., & Afonso, C. N. (2000). Laser-induced particle removal from silicon wafers. In High Power Laser Ablation III (Vol. 4065, pp. 249-259). (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.407353

@inproceedings{1edf17d73eac4ead8543aba55c8d8c4b,

title = "Laser-induced particle removal from silicon wafers",

author = "Paul Leiderer and J. Boneberg and V. Dobler and M. Mosbacher and H.-J. M{\"u}nzer and T. Fourrier and Gernot Schrems and Dieter B{\"a}uerle and Jakub Siegel and N. Chaoui and J. Solis and Afonso, \{C. N.\}",

year = "2000",

doi = "10.1117/12.407353",

language = "English",

volume = "4065",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

pages = "249--259",

booktitle = "High Power Laser Ablation III",

}

TY - GEN

T1 - Laser-induced particle removal from silicon wafers

AU - Leiderer, Paul

AU - Boneberg, J.

AU - Dobler, V.

AU - Mosbacher, M.

AU - Münzer, H.-J.

AU - Fourrier, T.

AU - Schrems, Gernot

AU - Bäuerle, Dieter

AU - Siegel, Jakub

AU - Chaoui, N.

AU - Solis, J.

AU - Afonso, C. N.

PY - 2000

Y1 - 2000

UR - https://www.scopus.com/pages/publications/0033685713

U2 - 10.1117/12.407353

DO - 10.1117/12.407353

M3 - Conference proceedings

VL - 4065

T3 - Proceedings of SPIE - The International Society for Optical Engineering

SP - 249

EP - 259

BT - High Power Laser Ablation III

ER -

Laser-induced particle removal from silicon wafers

Publication series

Fields of science

JKU Focus areas

Access to Document

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Cite this