Laser cleaning of silicon wafers: mechanisms and efficiencies

M. Mosbacher; M. Bertsch; H.-J. Münzer; V. Dobler; B.-U. Runge; Dieter Bäuerle; J. Boneberg; Paul Leiderer

doi:10.1117/12.456821

Laser cleaning of silicon wafers: mechanisms and efficiencies

M. Mosbacher, M. Bertsch, H.-J. Münzer, V. Dobler, B.-U. Runge, Dieter Bäuerle, J. Boneberg, Paul Leiderer

Institute of Applied Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

Original language	English
Title of host publication	Second International Symposium on Laser Precision Microfabrication
Pages	308-314
Number of pages	7
Volume	4426
DOIs	https://doi.org/10.1117/12.456821
Publication status	Published - May 2002

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)	0277-786X

Fields of science

103016 Laser physics
210005 Nanophotonics

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10.1117/12.456821

Cite this

Mosbacher, M., Bertsch, M., Münzer, H.-J., Dobler, V., Runge, B.-U., Bäuerle, D., Boneberg, J., & Leiderer, P. (2002). Laser cleaning of silicon wafers: mechanisms and efficiencies. In Second International Symposium on Laser Precision Microfabrication (Vol. 4426, pp. 308-314). (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.456821

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title = "Laser cleaning of silicon wafers: mechanisms and efficiencies",

author = "M. Mosbacher and M. Bertsch and H.-J. M{\"u}nzer and V. Dobler and B.-U. Runge and Dieter B{\"a}uerle and J. Boneberg and Paul Leiderer",

year = "2002",

month = may,

doi = "10.1117/12.456821",

language = "English",

volume = "4426",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

pages = "308--314",

booktitle = "Second International Symposium on Laser Precision Microfabrication",

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Mosbacher, M, Bertsch, M, Münzer, H-J, Dobler, V, Runge, B-U, Bäuerle, D, Boneberg, J & Leiderer, P 2002, Laser cleaning of silicon wafers: mechanisms and efficiencies. in Second International Symposium on Laser Precision Microfabrication. vol. 4426, Proceedings of SPIE - The International Society for Optical Engineering, pp. 308-314. https://doi.org/10.1117/12.456821

Laser cleaning of silicon wafers: mechanisms and efficiencies. / Mosbacher, M.; Bertsch, M.; Münzer, H.-J. et al.
Second International Symposium on Laser Precision Microfabrication. Vol. 4426 2002. p. 308-314 (Proceedings of SPIE - The International Society for Optical Engineering).

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

TY - GEN

T1 - Laser cleaning of silicon wafers: mechanisms and efficiencies

AU - Mosbacher, M.

AU - Bertsch, M.

AU - Münzer, H.-J.

AU - Dobler, V.

AU - Runge, B.-U.

AU - Bäuerle, Dieter

AU - Boneberg, J.

AU - Leiderer, Paul

PY - 2002/5

Y1 - 2002/5

UR - https://www.scopus.com/pages/publications/0036384569

U2 - 10.1117/12.456821

DO - 10.1117/12.456821

M3 - Conference proceedings

VL - 4426

T3 - Proceedings of SPIE - The International Society for Optical Engineering

SP - 308

EP - 314

BT - Second International Symposium on Laser Precision Microfabrication

ER -

Laser cleaning of silicon wafers: mechanisms and efficiencies

Publication series

Fields of science

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