Investigations on bond strength development of plasma activated direct wafer bonding with annealing

Thomas Plach; Kurt Hingerl; David Stifter; V. Dragoi; Markus Wimplinger

doi:10.1149/05007.0277ecst

Investigations on bond strength development of plasma activated direct wafer bonding with annealing

Thomas Plach
, Kurt Hingerl
, David Stifter
, V. Dragoi
, Markus Wimplinger

Center for Surface and Nanoanalytics

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	277-285
Number of pages	9
Journal	ECS Transactions - Electrochemical Society
Volume	50
Issue number	7
DOIs	https://doi.org/10.1149/05007.0277ecst
Publication status	Published - 2013

Fields of science

210006 Nanotechnology
103020 Surface physics
103021 Optics

JKU Focus areas

Engineering and Natural Sciences (in general)

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10.1149/05007.0277ecst

Cite this

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title = "Investigations on bond strength development of plasma activated direct wafer bonding with annealing",

author = "Thomas Plach and Kurt Hingerl and David Stifter and V. Dragoi and Markus Wimplinger",

year = "2013",

doi = "10.1149/05007.0277ecst",

language = "English",

volume = "50",

pages = "277--285",

journal = "ECS Transactions - Electrochemical Society",

issn = "1938-5862",

number = "7",

}

TY - JOUR

T1 - Investigations on bond strength development of plasma activated direct wafer bonding with annealing

AU - Plach, Thomas

AU - Hingerl, Kurt

AU - Stifter, David

AU - Dragoi, V.

AU - Wimplinger, Markus

PY - 2013

Y1 - 2013

UR - https://www.scopus.com/pages/publications/84885693653

U2 - 10.1149/05007.0277ecst

DO - 10.1149/05007.0277ecst

M3 - Article

SN - 1938-5862

VL - 50

SP - 277

EP - 285

JO - ECS Transactions - Electrochemical Society

JF - ECS Transactions - Electrochemical Society

IS - 7

ER -

Investigations on bond strength development of plasma activated direct wafer bonding with annealing

Fields of science

JKU Focus areas

Access to Document

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