Integrated mm-Wave Sensors in a Package

Reinhard Feger; Abouzar Hamidipour; Andreas Stelzer

Integrated mm-Wave Sensors in a Package

Reinhard Feger
, Abouzar Hamidipour
, Andreas Stelzer

Department of RF-Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

Abstract

We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.

Original language	English
Title of host publication	Proc. of the Asia Pacific Microwave Conference (APMC)
Pages	209- 211
Number of pages	3
Publication status	Published - Nov 2013

Fields of science

202019 High frequency engineering
202038 Telecommunications
202029 Microwave engineering
202033 Radar technology

JKU Focus areas

Mechatronics and Information Processing

Cite this

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title = "Integrated mm-Wave Sensors in a Package",

abstract = "We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.",

author = "Reinhard Feger and Abouzar Hamidipour and Andreas Stelzer",

year = "2013",

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language = "English",

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T1 - Integrated mm-Wave Sensors in a Package

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AU - Hamidipour, Abouzar

AU - Stelzer, Andreas

PY - 2013/11

Y1 - 2013/11

N2 - We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.

AB - We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.

UR - http://www.apmc2013.org/

M3 - Conference proceedings

SP - 209

EP - 211

BT - Proc. of the Asia Pacific Microwave Conference (APMC)

ER -

Integrated mm-Wave Sensors in a Package

Abstract

Fields of science

JKU Focus areas

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