In situ stress evolution during and after sputter deposition of Al thin films

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	225008
Pages (from-to)	225008/1-8
Number of pages	8
Journal	Journal of Physics: Condensed Matter
Volume	21
Issue number	22
DOIs	https://doi.org/10.1088/0953-8984/21/22/225008
Publication status	Published - 2009

Fields of science

@article{341a9fa175ca4d4a99cf36e6b2b46f03,

title = "In situ stress evolution during and after sputter deposition of Al thin films",

author = "M. Pletea and Reinhold Koch and H. Wendrock and R. Kaltofen and Schmidt, \{Oliver G.\}",

year = "2009",

doi = "10.1088/0953-8984/21/22/225008",

language = "English",

volume = "21",

pages = "225008/1--8",

journal = "Journal of Physics: Condensed Matter",

issn = "1361-648X",

publisher = "IOP Publishing Ltd",

number = "22",

}

TY - JOUR

T1 - In situ stress evolution during and after sputter deposition of Al thin films

AU - Pletea, M.

AU - Koch, Reinhold

AU - Wendrock, H.

AU - Kaltofen, R.

AU - Schmidt, Oliver G.

PY - 2009

Y1 - 2009

UR - https://www.scopus.com/pages/publications/66349113414

U2 - 10.1088/0953-8984/21/22/225008

DO - 10.1088/0953-8984/21/22/225008

M3 - Article

SN - 1361-648X

VL - 21

SP - 225008/1-8

JO - Journal of Physics: Condensed Matter

JF - Journal of Physics: Condensed Matter

IS - 22

M1 - 225008

ER -