Abstract
Adhesive bonds are particularly favored by lightweight structures due to their weight efficiency and insulating property regarding contact corrosion. However, it is challenging to interrogate directly over the bonding area due to its sandwiched structure. In this study, an inkjet-printed carbon nanotube (CNT) strain distribution sensing film is embedded at the interface between an adherend and the adhesive in a single-lap joint configuration to monitor the spatial strain distribution over the bonding area. The conductivity distribution reconstructed by an algorithm of electrical impedance tomography (EIT) results in similar trend to the correlated conductivity distribution numerically calculated from a three-dimensional (3D) finite element model. Moreover, the EIT result of a defect-embedded testing specimen shows a different conductivity distribution compared to the healthy specimen, indicating the existence of the debonding region.
| Original language | English |
|---|---|
| Pages (from-to) | 1479-1490 |
| Number of pages | 12 |
| Journal | Structural Health Monitoring |
| Volume | 18 |
| Issue number | 5-6 |
| DOIs | |
| Publication status | Published - 2019 |
Fields of science
- 203 Mechanical Engineering
- 203003 Fracture mechanics
- 203007 Strength of materials
- 203012 Aerospace engineering
- 203015 Mechatronics
- 203022 Technical mechanics
- 203034 Continuum mechanics
- 205016 Materials testing
- 201117 Lightweight design
- 203002 Endurance strength
- 203004 Automotive technology
- 203011 Lightweight design
- 205015 Composites
- 211905 Bionics
JKU Focus areas
- Mechatronics and Information Processing
- Engineering and Natural Sciences (in general)