Heat transfer analysis of micromachined thermal conductivity sensors

Roman Beigelbeck; Franz Kohl; Jochen Kuntner; Bernhard Jakoby

Heat transfer analysis of micromachined thermal conductivity sensors

Roman Beigelbeck
, Franz Kohl
, Jochen Kuntner
, Bernhard Jakoby

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

Abstract

Due to unique features, micromachined thermal sensors are an interesting alternative to classical macroscopic apparatuses for the determination of thermal conductivities. A typical drawback of sophisticated miniaturized sensing elements is the fact that for most devices no analytical solution of the heat conduction equation can be obtained and thus a numerical model has to be implemented to determine the thermal parameter(s) of interest. In this contribution, an analytical model of a micromachined sensor for measuring the thermal conductivity and diffusivity of different liquids is presented. The model not only accounts for the unique sensor geometry but also for additional spurious effects associated with the devices membrane. © 2005 IEEE.

Original language	English
Title of host publication	IEEE International Conference on Emerging Technologies and Factory Automation, ETFA
Subtitle of host publication	10th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2005
Pages	977 – 983
Volume	2
Publication status	Published - 2005
Externally published	Yes

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Fields of science

202 Electrical Engineering, Electronics, Information Engineering

Access to Document

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33847263117&partnerID=40&md5=e5d479206b7c277a2b9ff730a94dca62

Cite this

Beigelbeck, R., Kohl, F., Kuntner, J., & Jakoby, B. (2005). Heat transfer analysis of micromachined thermal conductivity sensors. In IEEE International Conference on Emerging Technologies and Factory Automation, ETFA: 10th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2005 (Vol. 2, pp. 977 – 983). Article 1612778 https://www.scopus.com/inward/record.uri?eid=2-s2.0-33847263117&partnerID=40&md5=e5d479206b7c277a2b9ff730a94dca62

@inproceedings{12183788008e411494ab170756cc503c,

title = "Heat transfer analysis of micromachined thermal conductivity sensors",

abstract = "Due to unique features, micromachined thermal sensors are an interesting alternative to classical macroscopic apparatuses for the determination of thermal conductivities. A typical drawback of sophisticated miniaturized sensing elements is the fact that for most devices no analytical solution of the heat conduction equation can be obtained and thus a numerical model has to be implemented to determine the thermal parameter(s) of interest. In this contribution, an analytical model of a micromachined sensor for measuring the thermal conductivity and diffusivity of different liquids is presented. The model not only accounts for the unique sensor geometry but also for additional spurious effects associated with the devices membrane. {\textcopyright} 2005 IEEE.",

keywords = "Heat transfer, Mathematical models, Micromachining, Parameter estimation, Thermal conductivity, Diffusivity, Sensor geometry, Thermal sensors, Sensors",

author = "Roman Beigelbeck and Franz Kohl and Jochen Kuntner and Bernhard Jakoby",

note = "Conference name: 10th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2005; Conference date: 19 September 2005 through 22 September 2005; Conference code: 69270",

year = "2005",

language = "English",

isbn = "078039402X",

volume = "2",

pages = "977 – 983",

booktitle = "IEEE International Conference on Emerging Technologies and Factory Automation, ETFA",

}

Beigelbeck, R, Kohl, F, Kuntner, J & Jakoby, B 2005, Heat transfer analysis of micromachined thermal conductivity sensors. in IEEE International Conference on Emerging Technologies and Factory Automation, ETFA: 10th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2005. vol. 2, 1612778, pp. 977 – 983. <https://www.scopus.com/inward/record.uri?eid=2-s2.0-33847263117&partnerID=40&md5=e5d479206b7c277a2b9ff730a94dca62>

Heat transfer analysis of micromachined thermal conductivity sensors. / Beigelbeck, Roman; Kohl, Franz; Kuntner, Jochen et al.
IEEE International Conference on Emerging Technologies and Factory Automation, ETFA: 10th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2005. Vol. 2 2005. p. 977 – 983 1612778.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review

TY - GEN

T1 - Heat transfer analysis of micromachined thermal conductivity sensors

AU - Beigelbeck, Roman

AU - Kohl, Franz

AU - Kuntner, Jochen

AU - Jakoby, Bernhard

N1 - Conference name: 10th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2005; Conference date: 19 September 2005 through 22 September 2005; Conference code: 69270

PY - 2005

Y1 - 2005

N2 - Due to unique features, micromachined thermal sensors are an interesting alternative to classical macroscopic apparatuses for the determination of thermal conductivities. A typical drawback of sophisticated miniaturized sensing elements is the fact that for most devices no analytical solution of the heat conduction equation can be obtained and thus a numerical model has to be implemented to determine the thermal parameter(s) of interest. In this contribution, an analytical model of a micromachined sensor for measuring the thermal conductivity and diffusivity of different liquids is presented. The model not only accounts for the unique sensor geometry but also for additional spurious effects associated with the devices membrane. © 2005 IEEE.

AB - Due to unique features, micromachined thermal sensors are an interesting alternative to classical macroscopic apparatuses for the determination of thermal conductivities. A typical drawback of sophisticated miniaturized sensing elements is the fact that for most devices no analytical solution of the heat conduction equation can be obtained and thus a numerical model has to be implemented to determine the thermal parameter(s) of interest. In this contribution, an analytical model of a micromachined sensor for measuring the thermal conductivity and diffusivity of different liquids is presented. The model not only accounts for the unique sensor geometry but also for additional spurious effects associated with the devices membrane. © 2005 IEEE.

KW - Heat transfer

KW - Mathematical models

KW - Micromachining

KW - Parameter estimation

KW - Thermal conductivity

KW - Diffusivity

KW - Sensor geometry

KW - Thermal sensors

KW - Sensors

M3 - Conference proceedings

SN - 078039402X

SN - 978-078039402-5

VL - 2

SP - 977

EP - 983

BT - IEEE International Conference on Emerging Technologies and Factory Automation, ETFA

ER -