TY - GEN
T1 - Frequency Domain Based Measurement Method for the Thermal Parameters of a Thin-Film Diaphragm Embedded in a MEMS Multi-Parameter Wind Sensor
AU - Beigelbeck, Roman
AU - Reyes-Romero, D.
AU - Cerimovic, Samir
AU - Kohl, Franz
AU - Voglhuber-Brunnmaier, Thomas
AU - Jakoby, Bernhard
AU - Urban, G.A.
PY - 2014
Y1 - 2014
N2 - We report on a novel method to determine the thermal conductivity, thermal diffusivity, and average emissivity of a thin-film
diaphragm embedded in a MEMS multi-parameter wind sensor. Compared to other measurement techniques for thermal thin-film parameters, our method does not require fabrication of custom specimens. The results can be obtained from frequency response measurements directly carried out on the wind sensor. We describe the theoretical background of this method, provide an efficient analytical model (validated by FEM simulations) for the parameter extraction from the raw measurement data, and demonstrate its application by sample measurements performed on multi-layer SixNy-SiO2 thin-film diaphragms.
AB - We report on a novel method to determine the thermal conductivity, thermal diffusivity, and average emissivity of a thin-film
diaphragm embedded in a MEMS multi-parameter wind sensor. Compared to other measurement techniques for thermal thin-film parameters, our method does not require fabrication of custom specimens. The results can be obtained from frequency response measurements directly carried out on the wind sensor. We describe the theoretical background of this method, provide an efficient analytical model (validated by FEM simulations) for the parameter extraction from the raw measurement data, and demonstrate its application by sample measurements performed on multi-layer SixNy-SiO2 thin-film diaphragms.
UR - http://www.scopus.com/inward/record.url?scp=84923346870&partnerID=8YFLogxK
M3 - Conference proceedings
VL - 87
T3 - Procedia Engineering
SP - 632
EP - 635
BT - Procedia Engineering
PB - Elsevier
ER -