Embedded Temperature and Anti-Icing Monitoring Systems Directly Printed on 3D Shaped Substrates

Marcel Knoll; Christina Offenzeller; Bernhard Jakoby; Wolfgang Hilber

doi:10.1109/JSEN.2020.2971833

Embedded Temperature and Anti-Icing Monitoring Systems Directly Printed on 3D Shaped Substrates

Marcel Knoll, Christina Offenzeller, Bernhard Jakoby, Wolfgang Hilber

Institute of Microelectronics and Microsensors

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	8984350
Pages (from-to)	5314-5321
Number of pages	8
Journal	IEEE Sensors Journal
Volume	20
Issue number	10
DOIs	https://doi.org/10.1109/JSEN.2020.2971833
Publication status	Published - 15 May 2020

Fields of science

202019 High frequency engineering
202021 Industrial electronics
202036 Sensor systems
203017 Micromechanics
202 Electrical Engineering, Electronics, Information Engineering
202027 Mechatronics
202028 Microelectronics
202037 Signal processing

JKU Focus areas

Digital Transformation

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/JSEN.2020.2971833

Cite this

@article{18c9dca4d8bd4ea094177ad0731406d0,

title = "Embedded Temperature and Anti-Icing Monitoring Systems Directly Printed on 3D Shaped Substrates",

author = "Marcel Knoll and Christina Offenzeller and Bernhard Jakoby and Wolfgang Hilber",

year = "2020",

month = may,

day = "15",

doi = "10.1109/JSEN.2020.2971833",

language = "English",

volume = "20",

pages = "5314--5321",

journal = "IEEE Sensors Journal",

issn = "1558-1748",

publisher = "IEEE",

number = "10",

}

TY - JOUR

T1 - Embedded Temperature and Anti-Icing Monitoring Systems Directly Printed on 3D Shaped Substrates

AU - Knoll, Marcel

AU - Offenzeller, Christina

AU - Jakoby, Bernhard

AU - Hilber, Wolfgang

PY - 2020/5/15

Y1 - 2020/5/15

UR - http://www.scopus.com/inward/record.url?scp=85083956428&partnerID=8YFLogxK

U2 - 10.1109/JSEN.2020.2971833

DO - 10.1109/JSEN.2020.2971833

M3 - Article

SN - 1558-1748

VL - 20

SP - 5314

EP - 5321

JO - IEEE Sensors Journal

JF - IEEE Sensors Journal

IS - 10

M1 - 8984350

ER -

Embedded Temperature and Anti-Icing Monitoring Systems Directly Printed on 3D Shaped Substrates

Fields of science

JKU Focus areas

UN SDGs

Access to Document

Other files and links

Cite this