Diffusion of thiols during microcontact printing with rigid stamps

Iris Bergmair, Michael Mühlberger, Elisabeth Lausecker, Kurt Hingerl, Rainer Schöftner

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	848-850
Number of pages	3
Journal	Microelectronic Engineering
Volume	87
DOIs	https://doi.org/10.1016/j.mee.2009.12.058
Publication status	Published - 2010

Fields of science

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title = "Diffusion of thiols during microcontact printing with rigid stamps",

author = "Iris Bergmair and Michael M{\"u}hlberger and Elisabeth Lausecker and Kurt Hingerl and Rainer Sch{\"o}ftner",

year = "2010",

doi = "10.1016/j.mee.2009.12.058",

language = "English",

volume = "87",

pages = "848--850",

journal = "Microelectronic Engineering",

issn = "1873-5568",

publisher = "ELSEVIER SCIENCE BV",

}

TY - JOUR

T1 - Diffusion of thiols during microcontact printing with rigid stamps

AU - Bergmair, Iris

AU - Mühlberger, Michael

AU - Lausecker, Elisabeth

AU - Hingerl, Kurt

AU - Schöftner, Rainer

PY - 2010

Y1 - 2010

U2 - 10.1016/j.mee.2009.12.058

DO - 10.1016/j.mee.2009.12.058

M3 - Article

SN - 1873-5568

VL - 87

SP - 848

EP - 850

JO - Microelectronic Engineering

JF - Microelectronic Engineering

ER -