Dielectric Characterization of RF-Printed Circuit Board Materials by Microstrip Transmission Lines and Conductor-Backed Coplanar Waveguides up to 110 GHz

Oliver Huber; Thomas Faseth; Gottfried Magerl; Holger Arthaber

doi:10.1109/TMTT.2017.2750152

Dielectric Characterization of RF-Printed Circuit Board Materials by Microstrip Transmission Lines and Conductor-Backed Coplanar Waveguides up to 110 GHz

Oliver Huber, Thomas Faseth, Gottfried Magerl, Holger Arthaber

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	8053920
Number of pages	8
Journal	IEEE Transactions on Microwave Theory and Techniques
DOIs	https://doi.org/10.1109/TMTT.2017.2750152
Publication status	Published - Jan 2018

Fields of science

202 Electrical Engineering, Electronics, Information Engineering

JKU Focus areas

Mechatronics and Information Processing

Access to Document

10.1109/TMTT.2017.2750152

Cite this

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title = "Dielectric Characterization of RF-Printed Circuit Board Materials by Microstrip Transmission Lines and Conductor-Backed Coplanar Waveguides up to 110 GHz",

author = "Oliver Huber and Thomas Faseth and Gottfried Magerl and Holger Arthaber",

year = "2018",

month = jan,

doi = "10.1109/TMTT.2017.2750152",

language = "English",

journal = "IEEE Transactions on Microwave Theory and Techniques",

issn = "1557-9670",

publisher = "IEEE",

}

TY - JOUR

T1 - Dielectric Characterization of RF-Printed Circuit Board Materials by Microstrip Transmission Lines and Conductor-Backed Coplanar Waveguides up to 110 GHz

AU - Huber, Oliver

AU - Faseth, Thomas

AU - Magerl, Gottfried

AU - Arthaber, Holger

PY - 2018/1

Y1 - 2018/1

U2 - 10.1109/TMTT.2017.2750152

DO - 10.1109/TMTT.2017.2750152

M3 - Article

SN - 1557-9670

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

M1 - 8053920

ER -