Abstract
Copper is a decisive component in electronic devices and conduction paths of printed circuits. The copper changes during electrical stress pulses. The surface can melt up as well as cracks and voids can develop inside the copper specimen.
We investigate how the copper surface changes during a sequence of electrical stress pulses. The copper surface is recorded by a high speed camera. Image processing techniques are required to determine and compute the changes of the surface structure. In the proposed paper, we illustrate a procedure of image processing techniques to improve and align the raw data images. Image differencing is used to determine temporal changes in the images leading to the copper surface change ratio, which is indicative of the information we seek.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 4th International Conference on Image Processing Theory, Tools and Applications |
| Number of pages | 6 |
| Publication status | Published - Oct 2014 |
Fields of science
- 202012 Electrical measurement technology
- 202036 Sensor systems
- 102003 Image processing
- 202015 Electronics
- 202016 Electrical engineering
- 202022 Information technology
- 202027 Mechatronics
- 202037 Signal processing
JKU Focus areas
- Mechatronics and Information Processing