Coupling and Decoupling in IEC 61499 and IEC 61131-3 Applications

Aydin Homay, Mario de Sousa, Alois Zoitl, Martin Wollschlaeger

Research output: Chapter in Book/Report/Conference proceedingConference proceedingspeer-review

Abstract

The history of the software industry has shown and proved that coupling and cohesion are a never-ending story in this industry. Quantifying the quality of software systems by measuring the strength of coupling and cohesion and considering it a rule that good software has low coupling between its parts and high cohesion within each part, is currently widely accepted. Every paradigm shift, new technology, language, etc. that didn`t consider this fact had to sooner or later leave this industry. It is, therefore, crucial to study and consider this fact in every new topic in the software industry. Surprisingly neither the IEC 61499 nor IEC 61131 communities have yet conducted a deep study to evaluate what coupling and cohesion really mean for Industrial Control and Automation Applications. We hope this paper will manage to fulfill this considerable gap, if not fully at least partially.
Original languageEnglish
Title of host publicationProceedings of the 27th International Conference on Emerging Technologies and Factory Automation (ETFA 2022)
Place of PublicationNew York City, USA
PublisherIEEE
Pages1-8
Number of pages8
ISBN (Electronic)9781665499965
ISBN (Print)978-1-6654-9996-5
DOIs
Publication statusPublished - Oct 2022

Publication series

NameIEEE International Conference on Emerging Technologies and Factory Automation, ETFA
Volume2022-September
ISSN (Print)1946-0740
ISSN (Electronic)1946-0759

Fields of science

  • 202017 Embedded systems
  • 102022 Software development
  • 102025 Distributed systems
  • 102029 Practical computer science
  • 202003 Automation
  • 202041 Computer engineering

JKU Focus areas

  • Digital Transformation

Cite this