Comparison of different bonding techniques for efficient strain transfer using piezoelectric actuators

Dorian Ziss; Javier Martin Sanchez; Thomas Lettner; Alma Halilovic; Giovanna Trevisi; Rinaldo Trotta; Armando Rastelli; Julian Stangl

doi:10.1063/1.4979859

Comparison of different bonding techniques for efficient strain transfer using piezoelectric actuators

Dorian Ziss, Javier Martin Sanchez, Thomas Lettner, Alma Halilovic, Giovanna Trevisi, Rinaldo Trotta, Armando Rastelli, Julian Stangl

Department of Semiconductor Physics

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobate-lead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the “soft” SU8 bonding in comparison to the “hard” bonding via gold-thermo-compression. A comparison between the XRD results and FEM simulations allows us to explain this unexpected result with the presence of complex interface structures between the different layers.

Original language	English
Article number	135303
Pages (from-to)	135303
Number of pages	7
Journal	Journal of Applied Physics
Volume	121
Issue number	13
DOIs	https://doi.org/10.1063/1.4979859
Publication status	Published - 2017

Fields of science

103 Physics, Astronomy

JKU Focus areas

Nano-, Bio- and Polymer-Systems: From Structure to Function

Access to Document

10.1063/1.4979859

Cite this

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title = "Comparison of different bonding techniques for efficient strain transfer using piezoelectric actuators",

abstract = "In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobate-lead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the “soft” SU8 bonding in comparison to the “hard” bonding via gold-thermo-compression. A comparison between the XRD results and FEM simulations allows us to explain this unexpected result with the presence of complex interface structures between the different layers.",

author = "Dorian Ziss and {Martin Sanchez}, Javier and Thomas Lettner and Alma Halilovic and Giovanna Trevisi and Rinaldo Trotta and Armando Rastelli and Julian Stangl",

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T1 - Comparison of different bonding techniques for efficient strain transfer using piezoelectric actuators

AU - Ziss, Dorian

AU - Martin Sanchez, Javier

AU - Lettner, Thomas

AU - Halilovic, Alma

AU - Trevisi, Giovanna

AU - Trotta, Rinaldo

AU - Rastelli, Armando

AU - Stangl, Julian

PY - 2017

Y1 - 2017

N2 - In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobate-lead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the “soft” SU8 bonding in comparison to the “hard” bonding via gold-thermo-compression. A comparison between the XRD results and FEM simulations allows us to explain this unexpected result with the presence of complex interface structures between the different layers.

AB - In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobate-lead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the “soft” SU8 bonding in comparison to the “hard” bonding via gold-thermo-compression. A comparison between the XRD results and FEM simulations allows us to explain this unexpected result with the presence of complex interface structures between the different layers.

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DO - 10.1063/1.4979859

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