Research output per year
Research output per year
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Einfluss von Stützkapazitäten auf die Soft Failures von Integrierten Schaltungen bei ESD Events
Translated title of the contribution :Influence of Decoupling Capacitors on Soft Failures of Integrated Circuits during ESD Events Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review
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Influence of Different Digital Power Supply Layout Styles on the EME of ICs with Respect to Process Variations
Rauchenecker, A. & Ostermann, T., Jun 2019, Proceedings 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI). 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review
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Analysis of the Load Dependency of Different ESD Simulation Models
Leitner, C. & Ostermann, T., 2018, 12th International Electrostatic Discharge Workshop IEW. 22 p.Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings › peer-review
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Elektromagnetische Störfestigkeitsprobleme in integrierten Schaltungen aufgrund elektrostatischer Entladungen
Translated title of the contribution :Electromagnetic susceptibility of integrated circuits due to electrostatic discharge Research output: Contribution to journal › Article › peer-review
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Elektrostatische Entladung – Grundlagen, Messvorschriften, Modelle und Simulationen bzgl. elektronischen Geräten/Systemen und Integrierten Schaltungen
Ostermann, T. & Leitner, C., 2018, EMV Fachtagung 2018. 20 p.Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings
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COMPAC: Computing Partitions using Analog Circuits
Rass, S. (PI), Ostermann, T. (Researcher), Kofler, G. (Researcher), Peherstorfer, A. (Researcher), Golser, M. (Researcher) & Hofwimmer, S. (Researcher)
01.11.2024 → 31.10.2026
Project: Funded research › Other mainly public funds
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Konzeption zur Reduzierung und Analyse der Störempfindlichkeit von ICs, MCUs und ASICs
Ostermann, T. (PI)
01.04.2021 → 31.03.2023
Project: Contract research › Industry project
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SAL Doctoral College
Ostermann, T. (Researcher) & Pretl, H. (PI)
01.01.2020 → 31.12.2023
Project: Funded research › Other sponsors
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Interactive digital hardware demonstrator
Gut, W. (Researcher) & Ostermann, T. (PI)
01.10.2019 → 29.02.2020
Project: Funded research › Federal / regional / local authorities
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Verbesserung der EMV-Robustheit von in ASICs/ICs integrierte Quarzoszillatoren
Ostermann, T. (PI)
30.09.2019 → 31.12.2020
Project: Contract research › Industry project
Activities
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Austrochip 2025
Pretl, H. (Organiser), Ostermann, T. (Organiser), Fath, P. (Organiser), Zachl, G. (Organiser), Köfinger, M. (Organiser), Köfinger, M. (Organiser) & Nikolaus, D. (Organiser)
2025 → …Activity: Participating in or organising an event › Organising a conference, workshop, ...
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Austrochip
Pretl, H. (Organiser), Fath, P. (Organiser), Hager, E. (Organiser), Mitta, R. (Organiser), Ostermann, T. (Organiser) & Zachl, G. (Organiser)
14 Oct 2021Activity: Participating in or organising an event › Organising a conference, workshop, ...
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Einfluss von Stützkapazitäten auf die Soft Failures von Integrierten Schaltungen bei ESD Events
Ostermann, T. (Speaker)
23 Oct 2019Activity: Talk or presentation › Contributed talk › science-to-science
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Influence of Different Digital Power Supply Layout Styles on the EME of ICs with Respect to Process Variations
Ostermann, T. (Speaker)
20 Jun 2019Activity: Talk or presentation › Contributed talk › science-to-science
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Elektrostatische Entladung – Grundlagen, Messvorschriften, Modelle und Simulationen bzgl. elektronischen Geräten/Systemen und Integrierten Schaltungen
Ostermann, T. (Speaker) & Leitner, C. (Speaker)
12 Jun 2018Activity: Talk or presentation › Contributed talk › science-to-science