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Using gallium as a protective layer during a solvent bonding process for lab-scale polymer based microfluidic device fabrication

  • Marcus Hintermüller (Speaker)

Activity: Talk or presentationPoster presentationscience-to-science

Description

A fabrication process for polymeric microfluidic devices using a solvent bonding technique is presented. Liquid gallium is filled into the channels beforehand, in order to keep their structural integrity intact during the bonding process. Due to its melting point just above room temperature, gallium features several advantages compared to other materials used in a similar fashion. The proposed method does not require special equipment and is especially suitable for rapid prototyping on a small academic lab scale.
Period03 Oct 2019
Event title4th International Conference on MicroFluidic Handling Systems (MFHS 2019)
Event typeConference
LocationNetherlandsShow on map

Fields of science

  • 202028 Microelectronics
  • 202027 Mechatronics
  • 202037 Signal processing
  • 202036 Sensor systems
  • 202 Electrical Engineering, Electronics, Information Engineering
  • 202021 Industrial electronics
  • 203017 Micromechanics
  • 202019 High frequency engineering

JKU Focus areas

  • Digital Transformation