Ultrasonic microscope to characterize the degradation of thin metal layers

Description

This article deals with imaging representation of the semiconductor layer degradation which is recorded with a high-resolution ultrasonic microscope. The degradation leads to local delaminations in the metal layer, which are applied electrochemically on a semiconducting material. An incorrect acoustic adjustment and a detectable ultrasonic echo are caused by the delaminations. Complex signal processing is required to determine the degradation of the recorded ultrasonic signal.

Period	26 Jun 2014
Event title	Metrological applications of ultrasound
Event type	Conference
Location	GermanyShow on map