Thermal Condition Monitoring System Fully Printed on a 3D Substrate

Description

In this work we present a condition monitoring device which is fabricated in a low cost printing process directly on the 3D shaped substrate. The temperature monitoring is performed by 24 thermocouples resulting in a 24 pixel temperature image of the sample. The thermocouples are printed in an array arrangement, which enables the reduction of the required connections from 48 to 25. The printing is performed in a two-step process in which first the sensor pattern is screen printed onto a transfer foil and then transferred in a second step onto the target substrate by water transfer printing.

Period	28 Oct 2019
Event title	IEEE Sensors 2019
Event type	Conference
Location	CanadaShow on map