Model development and verification for spectroscopic ellipsometry analysis of plasma-activated Si wafers for direct wafer bonding

  • Nikolaus Rauch (Speaker)

Activity: Talk or presentation › Poster presentation › science-to-science

Period04 Oct 2022
Event titleWaferBond'22 - The International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration, Schmalkalden University of Applied Sciences, Germany, 4.-6. Oct. 2022.
Event typeConference
LocationGermanyShow on map

Fields of science

  • 103 Physics, Astronomy
  • 210 Nanotechnology

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