Millimeter-wave radar systems on-chip and in package: Current status and future challenges

Description

In this work, we give an overview on recent developments that have been made in the field of mm-wave systems which are integrated on chip or in package. Several aspects like waveforms and signal generation, multi-channel systems for beamforming applications as well as integration of antennas into packages will be discussed. The focus of this work is put on approaches which are suitable for on-chip and in-package integration. The restrictions imposed by the integration into single devices are discussed and several prototype systems are presented.

Period	26 Jan 2015
Event title	IEEE Topical Conference on Wireless Sensors and Sensor Networks
Event type	Conference
Location	United StatesShow on map