Integrated mm-Wave Sensors in a Package

Description

We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.

Period	07 Nov 2013
Event title	Asia-Pacific Microwave Conference (APMC)
Event type	Conference
Location	Korea, Democratic People's Republic ofShow on map