Activity: Talk or presentation › Contributed talk › unknown
Description
This paper presents a 160-GHz transmitter and receiver in an embedded wafer level ball grid array package for
millimeter-wave applications. The transmitter and the receiver were realized in an SiGe:C HBT production technology with an fmax of 250 GHz. The transmitter features a frequency multiplier chain that scales a 4.3−4.6 GHz signal up to 155−165 GHz, and allows the use of a commercial signal source. The receiver employs a subharmonic mixer with LO and RF frequencies around
80 GHz and 160 GHz, respectively. A highly directional 160-GHz rhombic antenna array was designed and integrated with the aforementioned transmitter and receiver in two 6 × 6 mm2 packages. The performance of such a system in package was then evaluated and proved in a quasi-monostatic FMCW radar measurement setup with an up-chirp frequency sweep from 157 GHz to 160 GHz.
Period
07 Oct 2013
Event title
Microwave Integrated Circuits Conference (EuMIC), 2013 8th European