Wafer Bonding of Plasma Activated Surfaces

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Seiten (von - bis)	39-45
Seitenumfang	7
Fachzeitschrift	ECS Transactions - Electrochemical Society
Volume	13
Ausgabenummer	25
DOIs	https://doi.org/10.1149/1.3007997
Publikationsstatus	Veröffentlicht - 2008

Wissenschaftszweige

@article{413585f00fa8415093a8198b8f275fc7,

title = "Wafer Bonding of Plasma Activated Surfaces",

author = "Thomas Plach and V. Dragoi and Gerald Mittendorfer and Markus Wimplinger and Kurt Hingerl",

year = "2008",

doi = "10.1149/1.3007997",

language = "English",

volume = "13",

pages = "39--45",

journal = "ECS Transactions - Electrochemical Society",

issn = "1938-5862",

number = "25",

}

TY - JOUR

T1 - Wafer Bonding of Plasma Activated Surfaces

AU - Plach, Thomas

AU - Dragoi, V.

AU - Mittendorfer, Gerald

AU - Wimplinger, Markus

AU - Hingerl, Kurt

PY - 2008

Y1 - 2008

UR - https://www.scopus.com/pages/publications/67650388503

U2 - 10.1149/1.3007997

DO - 10.1149/1.3007997

M3 - Article

SN - 1938-5862

VL - 13

SP - 39

EP - 45

JO - ECS Transactions - Electrochemical Society

JF - ECS Transactions - Electrochemical Society

IS - 25

ER -