Using gallium as a protective layer during a solvent bonding process for lab-scale polymer based microfluidic device fabrication

Marcus Hintermüller; Bernhard Jakoby

Using gallium as a protective layer during a solvent bonding process for lab-scale polymer based microfluidic device fabrication

Marcus Hintermüller
, Bernhard Jakoby

Institut für Mikroelektronik und Mikrosensorik

Publikation: Beitrag in Buch/Bericht/Konferenzband › Konferenzbeitrag › Begutachtung

Abstract

A fabrication process for polymeric microfluidic devices using a solvent bonding technique is presented. Liquid gallium is filled into the channels beforehand, in order to keep their structural integrity intact during the bonding process. Due to its melting point just above room temperature, gallium features several advantages compared to other materials used in a similar fashion. The proposed method does not require special equipment and is especially suitable for rapid prototyping on a small academic lab scale.

Originalsprache	Englisch
Titel	Conference Proceedings of the 4th Conference on MicroFluidic Handling Systems
Seiten	152-155
Seitenumfang	4
Publikationsstatus	Veröffentlicht - Okt. 2019

Wissenschaftszweige

202019 Hochfrequenztechnik
202021 Industrielle Elektronik
202036 Sensorik
203017 Mikromechanik
202 Elektrotechnik, Elektronik, Informationstechnik
202027 Mechatronik
202028 Mikroelektronik
202037 Signalverarbeitung

JKU-Schwerpunkte

Digital Transformation

Dieses zitieren

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