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Processing of Interference Fringe Patterns to obtain highly localized Strain

Publikation: Beitrag in Buch/Bericht/KonferenzbandKonferenzbeitragBegutachtung

Abstract

Mechanical strain and displacement measurements are important in general material testing. Especially non-contacting methods like optical measurement are needed to analyze the behaviour of micro materials since no other standard method is otherwise available. In this paper a measurement method is introduced that fulfills these requirements. The device under test has to be prepared only with two Vickers micro hardness indentations. These two markers are illuminated by a collimated laser beam. The mechanical strain or displacement can be measured by scanning the diffracted light field using two CCD line scan cameras. The measurement system is able to resolve displacement of these indentations in the nm range.
OriginalspracheEnglisch
TitelInternational Workshop on Imaging Systems and Techniques
Seitenumfang3
PublikationsstatusVeröffentlicht - 2006

Wissenschaftszweige

  • 101014 Numerische Mathematik
  • 102003 Bildverarbeitung
  • 103021 Optik
  • 202 Elektrotechnik, Elektronik, Informationstechnik
  • 202012 Elektrische Messtechnik
  • 202014 Elektromagnetismus
  • 202015 Elektronik
  • 202016 Elektrotechnik
  • 202021 Industrielle Elektronik
  • 202022 Informationstechnik
  • 202024 Lasertechnik
  • 202027 Mechatronik
  • 202036 Sensorik
  • 202037 Signalverarbeitung
  • 202039 Theoretische Elektrotechnik
  • 203016 Messtechnik
  • 211908 Energieforschung

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