Investigations on bond strength development of plasma activated direct wafer bonding with annealing

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Seiten (von - bis)	277-285
Seitenumfang	9
Fachzeitschrift	ECS Transactions - Electrochemical Society
Volume	50
Ausgabenummer	7
DOIs	https://doi.org/10.1149/05007.0277ecst
Publikationsstatus	Veröffentlicht - 2013

Wissenschaftszweige

@article{676afe31c1724e61a0b07f853047a936,

title = "Investigations on bond strength development of plasma activated direct wafer bonding with annealing",

author = "Thomas Plach and Kurt Hingerl and David Stifter and V. Dragoi and Markus Wimplinger",

year = "2013",

doi = "10.1149/05007.0277ecst",

language = "English",

volume = "50",

pages = "277--285",

journal = "ECS Transactions - Electrochemical Society",

issn = "1938-5862",

number = "7",

}

TY - JOUR

T1 - Investigations on bond strength development of plasma activated direct wafer bonding with annealing

AU - Plach, Thomas

AU - Hingerl, Kurt

AU - Stifter, David

AU - Dragoi, V.

AU - Wimplinger, Markus

PY - 2013

Y1 - 2013

UR - https://www.scopus.com/pages/publications/84885693653

U2 - 10.1149/05007.0277ecst

DO - 10.1149/05007.0277ecst

M3 - Article

SN - 1938-5862

VL - 50

SP - 277

EP - 285

JO - ECS Transactions - Electrochemical Society

JF - ECS Transactions - Electrochemical Society

IS - 7

ER -