TY - GEN
T1 - High Temperature Micro-Hotplates on Porous Silicon Substrates
AU - Lucklum, Frieder
AU - Schwaiger, Alexander
AU - Jakoby, Bernhard
PY - 2013/6
Y1 - 2013/6
N2 - Standard structures for micro-hotplate applications are generally thin, often suspended silicon nitride and silicon oxide membranes. These devices only offer limited mechanical stability. More mechanically stable, thicker glass substrates suffer from thermal stability issues at elevated temperatures. We propose the use of thick porous silicon substrates which offer better thermal (i.e. lower) conductivity than silicon nitride almost as low as silica glass, improved mechanical stability, and operation at temperatures comparable to membrane devices. Heater structures have been fabricated on fully porosified silicon wafers and are compared to reference glass and silicon samples.
AB - Standard structures for micro-hotplate applications are generally thin, often suspended silicon nitride and silicon oxide membranes. These devices only offer limited mechanical stability. More mechanically stable, thicker glass substrates suffer from thermal stability issues at elevated temperatures. We propose the use of thick porous silicon substrates which offer better thermal (i.e. lower) conductivity than silicon nitride almost as low as silica glass, improved mechanical stability, and operation at temperatures comparable to membrane devices. Heater structures have been fabricated on fully porosified silicon wafers and are compared to reference glass and silicon samples.
UR - https://www.scopus.com/pages/publications/84891690372
U2 - 10.1109/Transducers.2013.6627165
DO - 10.1109/Transducers.2013.6627165
M3 - Conference proceedings
SN - 978-1-4673-5981-8
T3 - 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
SP - 1907
EP - 1910
BT - Proceedings Transducers 2013 & Eurosensors XXVII
PB - IEEE
CY - Piscataway, NJ
ER -