Diffusion of thiols during microcontact printing with rigid stamps

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Seiten (von - bis)	848-850
Seitenumfang	3
Fachzeitschrift	Microelectronic Engineering
Volume	87
Ausgabenummer	5-8
DOIs	https://doi.org/10.1016/j.mee.2009.12.058
Publikationsstatus	Veröffentlicht - Mai 2010

Wissenschaftszweige

@article{dcfb7cf9b1ff4a45a0a548dc251eadc5,

title = "Diffusion of thiols during microcontact printing with rigid stamps",

author = "Iris Bergmair and Michael M{\"u}hlberger and Elisabeth Lausecker and Kurt Hingerl and Rainer Sch{\"o}ftner",

year = "2010",

month = may,

doi = "10.1016/j.mee.2009.12.058",

language = "English",

volume = "87",

pages = "848--850",

journal = "Microelectronic Engineering",

issn = "1873-5568",

publisher = "ELSEVIER SCIENCE BV",

number = "5-8",

}

TY - JOUR

T1 - Diffusion of thiols during microcontact printing with rigid stamps

AU - Bergmair, Iris

AU - Mühlberger, Michael

AU - Lausecker, Elisabeth

AU - Hingerl, Kurt

AU - Schöftner, Rainer

PY - 2010/5

Y1 - 2010/5

UR - https://www.scopus.com/pages/publications/76949106080

U2 - 10.1016/j.mee.2009.12.058

DO - 10.1016/j.mee.2009.12.058

M3 - Article

SN - 1873-5568

VL - 87

SP - 848

EP - 850

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 5-8

ER -