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Using gallium as a protective layer during a solvent bonding process for lab-scale polymer based microfluidic device fabrication

  • Marcus Hintermüller (Vortragende*r)

Aktivität: Vortrag oder PräsentationPosterpräsentationScience-to-science

Beschreibung

A fabrication process for polymeric microfluidic devices using a solvent bonding technique is presented. Liquid gallium is filled into the channels beforehand, in order to keep their structural integrity intact during the bonding process. Due to its melting point just above room temperature, gallium features several advantages compared to other materials used in a similar fashion. The proposed method does not require special equipment and is especially suitable for rapid prototyping on a small academic lab scale.
Zeitraum03 Okt. 2019
Ereignistitel4th International Conference on MicroFluidic Handling Systems (MFHS 2019)
VeranstaltungstypKonferenz
OrtNiederlandeAuf Karte anzeigen

Wissenschaftszweige

  • 202028 Mikroelektronik
  • 202027 Mechatronik
  • 202037 Signalverarbeitung
  • 202036 Sensorik
  • 202 Elektrotechnik, Elektronik, Informationstechnik
  • 202021 Industrielle Elektronik
  • 203017 Mikromechanik
  • 202019 Hochfrequenztechnik

JKU-Schwerpunkte

  • Digital Transformation